Title: Advanced Packaging Associates
Description: Not available
Keywords:
QFN,
Quik-Pak,
Quik Pac,
AlN,
LTCC,
alumina,
AlSiC,
CuW,
substrate,
flex,
circuit,
rigid-flex,
MEMs,
SMT,
surface mount,
resistor,
capacitor,
thin film,
foundry,
A40,
A-40,
CuMo,
BeO,
DBC,
direct bond copper,
GPO,
GPPO,
hermetic,
Kovar,
SMTO-8,
plugged via,
Osprey,
CE7,
CE9,
CE11,
CE13,
CE17(
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